JavaScript seems to be disabled in your browser. For the best experience on our site, be sure to turn on Javascript in your browser.
Filling the gape between heating element and the cooling device, Increasing the contact area so as to achieve the soundest thermal conductivity effect.
Helps disperse the heat from CPU to heatsink effectively.
Suitable for: CPU, GPU ,heatsink, ovens, chipset, Xbox, High power LED and other components.
Excellent ease of use and outstanding long-term stability.